2022 Meetings


October Meeting

Agenda

Welcome

by Jim Wilcox


DSC Examination of BiSn Low Melt Solder with SnAgCu

by Peter McClure


Durafuse™ LT Solder Assembly: Early Observations

by Alyssa Yaeger


Creep Strength of High Reliability Solders in Thermal Cycle

by Mohamed Belhadi


Direct Observation of Thermal Interface Performance

by Peter McClure


Thermal Interface Material (TIM2) Reliability Test Update

by Peter McClure


BiSn Solder under Current Stress: Bi Accumulation and Variability

by Eric Cotts


Low Temperature Solder ATC with Current Stress

by Alyssa Yaeger


BiSn Solder Drop Shock Degradation with Current Stress

by Michael Meilunas


Sintered Copper Interconnects

by Peter Borgesen


Crystallographic Investigation of Hybrid LTS Solder Ball Drift

by Jingwei Xian and Chrisopher Gourlay


Intel Heterogeneous Integration Prototype (SHIP) Facility

by Saikumar Jayaraman and John Sotir


Thermal Cycle Fatigue Acceleration with SnBi Solder Joints

by Faramarz Hadian


ATC Reliability Testing Update

by Michael Meilunas



March Meeting

Agenda

Welcome/Introduction

by Jim Wilcox

LCP Flex Bonding: Design/Process Considerations

by Dylan Richmond, Peter McClure

Comparing Semi-Sintering Silver Pastes on Gold Surfaces

by Pericles Kondos

Heraeus DA320 Silver Sinter Paste: An Update

by Pericles Kondos

Solder Joint Gold Embrittlement Observations

by Alyssa Yaeger

Conformal Coating Sulfur Corrosion Failure Rates and Mechanisms

by Marie Cole, Eric Campbell

New Variables in Low Temperature Solder (LTS) Drop Performance

by Jeremy Gendler

Low Temperature Solder (LTS) Mechanical Behavior

by Alyssa Yaeger

LTS ATC Failure & Reliability Observations: Hybrid and Homogeneous Joints

by Michael Meilunas

Enhancing Moore’s Law’s Next Frontier through Heterogeneous Integration

by Deepak Kulkarni

Solder Joint Electromigration during Constant Current and Temperature Stress

by Javier Flores

Quality Testing of TIM1s in Packages with Laser Heating: Initial Proof of Concept Study

by Peter McClure

Adding Conductivity Measurements to ATC TIM Test Boards: IR Measurement of Heating

by Peter McClure

SAFI-Tech Liquital® Supercooled Liquid Solder Spheres: A First Look

by Pericles Kondos

Further Evaluation of Ni-less ENIG Premium Surface Finish

by Pericles Kondos

Pad Repair with Aerosol Jet Print of Copper Ink: Update

by Peter McClure