2021 Meetings


October Meeting

Agenda


Welcome by Jim Wilcox

REL20B. Thermal Stability of Electrolytic Capacitors

by Michael Meilunas

REL20A. Multilayer Ceramic Capacitor Cracking Evaluation

by Michael Meilunas

MAT2D. Pad Cratering Resistance of Cap Layer Laminates

by Michael Meilunas

MAT1C. Component Edge Bonding: Process and Reliability

by Pericles Kondos

MAT7H. Low Temperature Solder Reliability: ATC Performance

by Michael Meilunas

APD11A. BGA Pad Repair using Aerosol Jet Printing

by Dylan Richmond

REL2B. Drop Shock Modeling: Effect of Solder Joint Geometry

by Jim Wilcox, Mohammad Gharabeih, Luke Wentlent

REL10C. Drop Shock Behavior of Hybrid Low Temperature Solder Joints

by Jim Wilcox, Michael Meilunas,

Qorvo -- SHIP-RF Overview (Heterogeneous Integration Packaging prototype facility)

by Ted Jones

REL8B. Underfilled WLCSP Reliability (No-Clean Assembly)

by Michael Meilunas

MAT3A. "Ni-less ENIG Premium" Surface Finish Evaluation

by Pericles Kondos

REL11C. Crystallographic Investigation of Hybrid LTS Ball Drift

by Christopher Gourlay, Jingwei Xian

REL18B. Current Stressing in Near Eutectic BiSn Low Temperature Solder Alloys

by Eric Cotts, Faramarz Hadian, Javier Flores, Sitaram Panta

MAT6C. Heraeus DA320 Silver Sinter Paste

by Pericles Kondos

MAT4D. Liquid Metal Thermal Interface Stability

by Peter McClure

MAT4E. Thermal Interface Material Testing Apparatus

by Peter McClure



March Meeting

Agenda

Welcome/Introduction

by Jim Wilcox

MAT2D. Laminate Pad Cratering Analysis using Monotonic Bend Test

by Michael Meilunas

REL10C. Solder Alloy Drop Shock Performance

by Luke Wentlent, Tian Sang

MAT3B. Reliability of Electrolytic Pd, Autocatalytic Au (EPAG) Surface Finish

by Michael Meilunas

MAT7H. Low Temperature Solder Reliability: 0/100C ATC Performance and ATC Profile Effects

by Luke Wentlent, Michael Meilunas

MAT4B. Graphite Thermal Pad Reliability Testing

by Peter McClure, Dylan Richmond

REL17A. Interval Testing TIMs in ATC -- Experimental Design and Debug

by Peter McClure

Dyconex -- Reliability and Biostability of Bio-Electronic Implants

by Eckardt Bihler

MAT4D. Liquid Metal Thermal Interface Material Processing

by Pericles Kondos

Saab -- Solderability and Wetting of Immersion Tin Finish

by Jan Gilldorf

Electromigration in Homogeneous Near Eutectic BiSn Solder Joints

by Faramarz Hadian, Eric Cotts

MAT7A. Thermal Cycle Dwell Time Effects in High Reliability Solders

by Luke Wentlent

MAT1C. Component Edge Bonding: Process and Reliability

by Pericles Kondos, Xinyu Zhang

MAT1C. Component Edge Bonding: Rework Process Trials

by Pericles Kondos, Xinyu Zhang

REL9A. PCB Thermal Response of Mixed VIPPO BGA Array

by Pericles Kondos