2020 Meetings

October Meeting

Agenda

Welcome/Introduction

by Jim Wilcox

MAT4C - Thermal Cycle Testing of Thermal Grease Materials

by Peter McClure

MAT4B - Electrical Resistance Monitoring of Graphite Thermal Pads in ATC

by Peter McClure, Dylan Richmond

MAT4D - Gallium-Indium Liquid Metal Thermal Interface Studies

by Peter McClure, Andra Chen

MAT6C - Semi-Sintering Silver Paste

by Pericles Kondos, Xinyu Zhang

Screen Printed Ink Circuitry - Optimizing Resolution

by Peter McClure, David Shaddock

MAT1C - Component Edge Bonding: Process and Reliability

by Pericles Kondos, Xinyu Zhang

REL17A - Effect of Current Stress on near Eutectic SnBi Solder Joints

by Faramarz Hadian, Eric Cotts

HP Labs - 3D Printed Electronics with Multi Jet Fusion

by Kris Erickson

MAT7F - Low Temperature Solder Joint Mechanical Behavior

by Luke Wentlent

MAT7H - Thermal Cycle Reliability of BiSn Solder Interconnects

by Michael Meilunas

REL17B - Low Temperature Solder Reliability Failure Mechanisms

by Luke Wenlent

MAT7A - High Performance Solder Alloys: Dwell Time Studies

by Jim Wilcox, Luke Wentlent

REL10B - High Performance Solder Alloys: Drop Shock

by Tian Zhang, Luke Wentlent

REL3E - High Performance Solder Alloys: Vibration

by Arvind Srinivasan, Michael Meilunas, Sa'd Hamasha

REL15B - Power Cycle Reliability Testing (QFN, BGA)

by Michael Gaynes, Michael Meilunas

March Meeting

Agenda

Welcome/Introduction

by Jim Wilcox

MAT7F. Microstructure Observations in As-Reflowed SnBi Mixed Solder Joints

by Luke Wentlent

REL17A. Effects of Current Stress on the Microstructure of SnBiAg-SAC Mixed Solder Joints

by Faramarz Hadian, et al.

MAT7I. Low Temperature Solder Thermal Cycle Reliability Testing and Failure Mechanisms

by Michael Meilunas and Luke Wentlent

MAT7F. Mechanical Behavior of Low Melt Mixed Assembly Joints

by Luke Wentlent

REL8A. ATC Reliability of Large Body WLCSP and SMT Devices on Low CTE PCB

by Michael Meilunas

MAT3B. PCB Surface Finishes: EPAG, ENIG, & Cu/OSP

by Michael Meilunas

REL18A. Failure Detection in Underfilled Components

by Michael Meilunas

MAT1C. Component Underfill and Edge Bonding Project Update

by Pericles Kondos

MAT4C. Thermal Cycle Testing of Thermal Grease and Phase Change Materials

by Peter McClure

MAT4E. Liquid Ga-In Die Level Thermal Interface Material -- Initial Studies

by Peter McClure

APD3C. Copper Coin PCBs -- Preliminary Reliability Evaluation

by Peter McClure

REL2B. High Performance Solder Alloy Studies: Thermal Shock and Dwell Time Effects

by Luke Wentlent

Thermal Fatigue of High Performance Pb-Free Solder Alloys (iNEMI)

by Richard Coyle

APD11B. Selected Area Laser Reflow of Temperature Sensitive Components

by Luke Wentlent

REL9A. Mixed VIPPO BGA Array Solder Defects

by Pericles Kondos and Tian Sang