October Meeting

Agenda

Welcome/Introduction

- by Jim Wilcox

REL15C. Power Cycle Testing

- by Michael Gaynes

APD2B. Flexible Substrate Chip Joining

- by Peter McClure, Mukund Ayalasomayajula

MAT8D. Conformal Coating for Mitigation of Sulfur Induced Resistor Corrosion

- by Marie Cole, et al.

MAT7F. Low-Melt BiSn Mixed Solder Assembly

- by Luke Wentlent

REL18A. Electromigration Behavior of BiSn Mixed Solder Joints

- by Faramarz Hadian

Packaging Challenges for SiC Power Semiconductors

- by Arun Gowda

APD8A. In-line Vacuum Reflow SMT Process

- by Michael Meilunas, Arvind Karthikeyan

APD11B. Laser Reflow Die Stacking

- by Luke Wentlent

REL9A. Mixed VIPPO Array Solder Joint Defects

- by Pericles Kondos

REL5B. Screening the PCB Microvia Reliability Problem

- by Kevin Knadle

MAT6C. Sintered Silver Die Attach Materials Update

- by Pericles Kondos

MAT4B,C. Thermal Interface Materials (TIM2): Performance & Reliability

- by Michael Gaynes, Mukund Ayalasomayajula

MAT6G. Pb-free Solder Alloys for Engine Control Applications

- by Michael Meilunas

MAT9B. Self Assembly Paste Evaluation SAP consolidation video - 8X (pg. 7)

- by Peter McClure

Effect of Precipitate Coarsening on Solder Joint Life in Test and Use

- by Thaer Alghoul, Peter Borgesen

APD2B. Ultra-thin Wafer Die Ejection from Tape

- by Peter McClure, Preeth Sivakumar

May Meeting

(San Jose, CA)

Agenda

Welcome/Introduction

- by Jim Wilcox

Sintered Silver Bonding Studies

- by Pericles Kondos (presented by J. Wilcox)

Pb-free Solder Alloy Evaluations

- by Luke Wentlent

Thermal Interface Materials: Performance & Reliability

- by Michael Gaynes (presented by J. Wilcox)

System in Package (SiP) Interconnect Reliability

- by Michael Meilunas (presented by J. Wilcox

Area Selective Laser Reflow Assembly

- by Luke Wentlent

Flexible Electronics Substrate Assembly

- by Peter McClure (presented by L. Wentlent)

Mixed VIPPO Array Soldering Defects

- by Pericles Kondos (presented by J. Wilcox)

March Meeting

Agenda

Welcome/Introduction

- by Jim Wilcox

APD2B. Flexible Substrate Chip Joining

- by Peter McClure

APD2C. SnAgCu Soldering to Conductive Ink Circuitry

- by Peter McClure

MAT6G. Solder Alloys for Engine Control Applications

- by Luke Wentlent

PCB Hole Fill Process Capability Study

- by Anjani Ladhar

REL9A. Mixed VIPPO Array BGA Soldering Defects

- by Pericles Kondos

MAT7F. Low Temperature Mixed Solder Assembly: Mechanical Characterization

- by Peter Borgesen

MAT7F. Low Temperature Mixed Solder Assembly: High Strain Rate Fragility

- by Luke Wentlent

MAT4D. High Performance Die Level Thermal Interface Materials

- by Divya Choudhary

REL17A. System in Package Interconnect Reliability - SAC305

- by Michael Meilunas

AREA Research Portfolio Briefs - March 2018

- by Michael Meilunas, Pericles Kondos, Michael Gaynes

IPC Assembly Specification Updates

- by Brook Sandy-Smith

Conformal Coating for Sn Whisker Mitigation

- by Fei Dong

MAT8B. Conformal Coating Thermal Cycle Reliability Impact

- by Michael Meilunas

MAT8D. Conformal Coating for Mitigation of S Induced Resistor Corrosion

- by Marie Cole

REL15C. Power Cycle Reliability Testing

- by Michael Gaynes

APD11B. Laser Selective Reflow Assembly and Reliability

- by Luke Wentlent

APD11C. Laser Rework Station Development

- by Brian Sohn