2017 Meetings

October Meeting

Agenda

Welcome/Introduction

- By Jim Wilcox

Electromigration Study of Lead-Free Solder Joints

- By Faramarz Hadian

MAT8D. Sulfur Resistor Corrosion: Conformal Coating Mitigation and Supplier Sensitivity

- By Michael Gaynes and Holly Rubin

MAT4D. High Performance Die Level Thermal Interface Materials

- By Divya Choudhary

APD11B. Laser Reflow Fundamentals

- By Luke Wentlent

Flexible Hybrid Electronic Materials

- By Christopher Ober

APD2B. Joining to Flexible Substrates with Asymmetric Heating

- By Peter McClure

APD11. Laser Reflow Application Studies

- By Luke Wentlent

REL9A. Mixed VIPPO Solder Defect Studies

- By Pericles Kondos

Effect of Long Term Aging on the Fatigue Properties of SnAgCu Solder Joints

- By Sa'd Hamasha

REL16A. Die Size Effects on BGA Reliability and Mechanical Modeling Thereof

- By Peter McClure and Mahdi Farahikia

REL17A. System-in-Package Interconnect Reliability - SAC305

- By Michael Meilunas

REL15B,C. Power Cycle Reliability Testing

- By Michael Gaynes

Laser Reflowed Solder Joints / Mechanical Behavior / Quantitative Metallography

- By Luke Wentlent and Thaer Alghoul and Mohammed Genanu

SnAgCu Elevated Temperature Aging Study

-By Peter McClure

REL11B. HiP Assembly Challenges with Window PCB

- By Michael Meilunas

MAT6C. Sintered Ag Die Attach Materials

- By Pericles Kondos

June Meeting

Agenda

Welcome/Introduction

- By Jim Wilcox

APD3B. Large Body BGA Characterization

- By Michael Meilunas

REL15C. Combined Power Cycle & Environmental Thermal Cycle

- By Michael Gaynes

REL7A. SnAgCu Thermal Aging Effects

- By Peter McClure

MAT6C. Sintered Silver Die Attach Materials

- By Pericle Kondos

MAT4B. Reliability of TIM2 Materials

- By Michael Gaynes

REL9A. Mixed VIPPO Solder Defect Investigation

- By Pericles Kondos

REL12A. Thermal Cycle Test of 2.5D Copper Pillar Interconnects

- By Mohammed Genanu

Bismuth Based Transient Liquid Phase Bonding

- By Junghyun Cho

MAT7E. Alternate Pb-free Solder Alloy Reliability

- By Francis Mutuku

MAT6G. Solder Alloys for Automotive Applications

- By Luke Wentlent

APD2B. Joining for Flexible Hybrid Electronics

- By Peter McClure

Low Temperature Mixed Solder Assembly

- By Peter Borgesen

APD11B. Laser Reflow Assembly -- First Looks

- By Luke Wentlent

March Meeting

Agenda

Welcome/Introduction

- By Jim Wilcox

REL12A. 2.5D Copper Pillar Interconnect Structures

- By Mohammed Genanu

APD11A. Laser Reflow Flip Chip Characterization

- By Jim Wilcox

MAT2A. Four Point Bend Pad Cratering Study

- By Michael Meilunas

REL3E. Laminate Material Effects in Mechanical Reliability Testing

- By Michael Meilunas

REL10B. Solder Alloy Mechanical Reliability Testing

- By Michael Meilunas

Reliability Impact of Long Term Thermal Aging on Lead Free Solders

- By Sa'd Hamasha

MAT4B. TIM2 Performance Evaluations TIM2 Characterization Review

- By Michael Gaynes

MAT4C. Ganged Heatsink TIM2 Reliability

- By Michael Gaynes

MAT9B. Flexible Hybrid Electronics: Materials and Assembly

- By Nancy Stoffel

MAT1B. Reworkable Component Underfills

- By Pericles Kondos

MAT7E. Solder Alloy Reliability Studies

- By Francis Mutuku

MAT6C. Sintered Silver Die Attach Materials

- By Pericles Kondos

REL15B,C. Power Cycle Reliability Testing

- By Michael Gaynes

REL2A. Deformation Behavior of SnAgCu Solder in Variable Amplitude Cycling

- By Luke Wentlent

REL17B. SiP Structures - Alternate Solder Alloy Interconnects

- By Michael Meilunas

REL9A. Mixed VIPPO Array BGA Soldering Defects

- By Matt Kelly