2016 Meetings

October Meeting

Agenda

MAT7H. SnBi(Ag) Low Melting Temperature Solder

- By Francis Mutuku

MAT6F. Alternative Alloy Drop Shock Testing

- By Jim Wilcox

REL3D. Elevated Temperature Harmonic Vibration

- By Xin Huang

Intermetallic Spalling

- By In-Tae Bae

Next Generation Biometric Security Access System

- By Don Lee (Samsung)

APD1D. Solder Process Voiding Study

- By Michael Meilunas

QFN Thermal Modeling QFN Thermal Calculator

- By Matt Schwiebert

REL15A. Power Cycle Reliability Testing

- By Michael Gaynes

REL12A. Copper Pillar Interconnects

- By Mohammed Genanu

area Laser Selective Reflow (aLSR)

- By J.J. Choi

APD11A. aLSR Flipchip Assembly

- By Jim Wilcox

Flexible Hybrid Electronics / Thin Die Assembly

- By Eric Forsythe (Army Research Lab)

REL16A. Die Size Effects on Thermal Fatigue Reliability

- By Richard Coyle and Jim Wilcox

MAT7E. Alternative Solder Alloy ATC Reliability

- By Francis Mutuku

MAT1B. Component Underfills: Process & Performance

- By Pericles Kondos

MAT4B. Thermal Characterization of TIM Putties

- By Michael Gaynes

APD1C. Fine Pitch Paste Printing (50um & 80um Stencils)

- By Michael Meilunas

June Meeting

Agenda

Welcome/Introduction

- By Jim Wilcox

MAT6C. Sintered Silver Die Attach: Materials & Process

- By Pericles Kondos and Falguni Sood

MAT7x. Alternative Solder Alloy Reliability Studies

- By Francis Mutuku

MAT6D. High Temperature Passive Device Surface Finish

- By Faramarz Hadian

REL3C. Elevated Temperature Vibration Testing

- By Quang Su and Xin Huang

Failure Detection Criteria

- By Mike Meilunas

MAT4B. Thermal Interface Materials Characterization

- By Mike Gaynes

MAT1B. Reworkable Component Underfills

- By Pericles Kondos

REL6A. Reliability Consequences of Paste Print Variability

- By Mike Meilunas

Solder Paste Printing Performance

- By Denis Barbini

Adaptive Paste Printing Process

- By Hakan Ugur

APD1A. Broadband Solder Paste Printing

- By Mike Meilunas

March Meeting

Agenda

Welcome/Introduction

- By Jim Wilcox

MAT8B. Conformal Coating: New Materials & Methods

- By Mike Meilunas

MAT8B. Conformal Coating for Resistor Corrosion Protection

- By Marie Cole

REL15A. Power Cycle Reliability Test On Demand

- By Mary Hatfalvi

MAT7G. Effect of Alloy Composition on Isothermal Solder Joint Shear Fatigue

- By Francis Mutuku

MAT7E. Thermal Fatigue Performance of Third Generation Pb-free Solder Alloys

- By Babak Arfaei

REL16A. Die Size Effects on BGA Package Interconnect Reliability

- By Richard Coyle

REL12A. Fine Pitch Copper Pillar Interconnect

- By Mohammed Genanu

MAT1B. Reworkable Component Underfills

- By Pericles Kondos and Andrew Feigel

MAT9A. Conductive Filled Elastomer Connections

- By Mike Meilunas

MAT6D. Component Terminations for Elevated Temperature Operation

- By Faramarz Hadian

Exploring Bismuth as a New Pb-free Alternative for High Temperature Electronics

- By Jungyhun Cho

REL6A. Solder Paste Printing Correlations to Reliability:

BGA Components - By Mike Meilunas

Bottom Terminated (QFN) Components - By Sai Sriperumbudur

APD1A. Broadband Solder Paste Printing

- By Mike Meilunas

Quantitative Image Analysis Methods for SAC305 Microstructures

- By Larry Lehman

MAT6C. Sintered Silver Die Attach Processing

- By Pericles Kondos

Sintered Silver Creep Deformation

- By Peter Borgesen