2014 Meetings

November Meeting

Wednesday Morning

Agenda

Introduction

- By Jim wilcox

MAT1A – Underfill Studies:

a) Reliability Update and Failure Analysis

On Demand

b) Underfilm instead of Underfill

On Demand

- By Pericles Kondos

MAT6B – Characterization of Ag-sintered Past as Pb-free Die Attach Material as

Pb-free Die Attach Material

On Demand

- By Harry Schoeller

MAT7B – Isothermal Shear Fatigue Behavior of Microalloyed Lead-Free Solder Alloys

On Demand

- By Francis Mutuku

MAT7D –Drop Shock Reliability of Various Lead-Free Alloys

On Demand

- By Babak Arfaei

Pb-free Manhattan Project - Rebaseline -

- By Linda Woody

Wednesday Afternoon

MAT8A – Impact of Conformal Coatings on Thermal Cycle Reliability of SMT Components

On Demand

- By Michael Meilunas

MAT7A – Effect of PCB Surface Finish and Solder Volume on Thermal Fatigue Performance of

Lead-Free and SnPb Solder Joints On Demand

- By Babak Arfaei

MAT6C – Thermo-mechanical Reliability of High Temperature Interconnects

- By Harry Schoeller

REL3A – Finite Element Analysis and Experimental Characterization for

Vibration Reliability of LGA vs. BGA Packages

- By Quang Su and Aaron Stewart

PERM Project Updates

- By Dave Pinsky,Tony Rafanelli,

Dave Hillman, Sebastian Fonseka,

Steve Davidson

Thursday Afternoon

REL2A – Model for Fatigue Life of Lead-free Solder

On Demand

- By Peter Borgesen

REL2A – Effects of Varying Amplitude on Solder Joint Fatigue in Isothermal Cycling

On Demand

- By Sa’d Hamasha

REL11A – Effect of TIM Compression Loads on BGA Reliability

On Demand

- By Nicholas Graziano

MAT6B – Isothermal Fatigue of High Melting Point Alloys

- By Harry Schoeller

MAT2B – Effect of Pad Locations relative to Glass Weave on Cratering

On Demand

- By Mohammad Quran

MAT6A – Effect of Sn Component Surface Finish on 92.5PbSn2.5Ag

On Demand

- By Harry Schoeller

MAT6B –2015 Research Plan Highlights

- By Jim Wilcox

June Meeting

Agenda

June AREA Introduction

- By Martin Anselm

Materials Track

MAT1A Underfill Part I - On Demand

- By Pericles Kondos

MAT1A Underfills and Adhesives-Part II - On Demand

- By Mohammad Quaran

MAT4A – Characterization of Gap Pads with Fixed Bondline and Phase Change Materials - On Demand

- By Harry Schoeller

REL11A Effect of Compression Loads on BGA Reliability - On Demand

- By Nicholas Graziano

MAT8A Conformal Coating Update - On Demand

- By Martin Anselm

MAT2A Pad Cratering in TB2014-ELM - On Demand

- By Pericles Kondos

MAT6C – Characterization of High Temperature Solder Alloys - On Demand

- By Harry Schoeller

MAT7B Effect of Microstructure on Isothermal Mechanical Properties of Various Solder Alloys - On Demand

- By Francis Mutuku

MAT7C Effect of Isothermal Aging on Reliability of LF Product - On Demand

- By Babak Arfaei

The Effect of Microalloying on Thermal Fatigue Reliability and Microstructure of SAC Solders Ni Microalloying

- By Richard Coyl (Alcatel-Lucent) ref: p765 Coyle et al. 64th ECTC

Advanced Process Development (APD) Track

SigNature® DNA – DNA-based Anti-counterfeiting Technology Solution

- By Janice Meraglia (VP for Military and Government Programs at Applied DNA Sciences)

MAT6B Characterization of High Temperature Solders used for Passive Devices - On Demand

- By Harry Schoeller

MAT5A Paste Print Project Status Update

- By Chris Anglin

Reliability Track

REL2A Correlation Between Accumulated Work and Fatigue Life of Lead-free Solder Joints

- By Peter Borgesen

REL6A Print Correlations to Reliability- On Demand

- By Michael Meilunas

REL3A LGA vs. BGA Vibration Performance

- By Aaron Stewart

REL10A Drop test JESD22-B111 Redesign Evaluation Characterization of Proposed JEDEC Drop Test Vehicle

On Demand

- By Michael Meilunas

MAT7A Effect of Nanodopants on Reliability of LF Solders in Drop Testing - On Demand

- By Babak Arfaei

February Meeting

Agenda

February AREA Introduction - On Demand

- By Martin Anselm

Reliability Track

MAT4A: Component Level TIM Characterization (Final Report) - On Demand

- By Harry Schoeller

REL2A: Correlation Between Accumulated Work and Fatigue Life of Lead-free Solder Joints - On Demand

- By Sa'D Hamasha

REL2A: Effects of Sn-grain Orientation on the Fatigue Life of Lead-free Solder Joints - On Demand

- By Sa'd Hamash and Luke Wentlent

REL10A: Drop Test JESD22-B111 Redesign Evaluation

- By Michael Meilunas

REL4A: Creep Corrosion - On Demand

- By Pericles Kondos

REL9A: HDI Design Review

- By Michael Meilunas

REL3A: Circuit Board Strain Laser Vibrometer

- By Prof. Quang Su (Binghamton University)

REL3B: Vibration Reliability Plans

- By Prof. Quang Su (Binghamton University)

- Prof. Su's Combined Presentations On Demand

Design and Reliability - On Demand

1 Inch Metal Ball Drop on Glass - Video

300mm Wafer Warpage during Reflow - Video

Cell Phone Case with PCB - Video

Board Strain - Video

Component Warpage at Elevated Temperature - Video

- By Prof. SB Park

Modeling and Characterization for Shock and Vibration - On Demand

- By Prof. James Pitarresi (Binghamton University)

Advanced Process Development (APD) Track

APD3B: WLCSP Reliability Analysis Effect of RDL Design on Thermal Cycle Results

- By Michael Meilunas

APD8A: BGA vs. LGA Drop Test Comparison - On Demand

- By Gaurang Joshi

ADP3A: TB2013 ATC Reliabiliy

- By Michael Meilunas

SPI Optimization - Koh Young - On Demand

- By JD Shin of Koh Young

BVA Review - Invensas - On Demand

- By Charles Woychik of Invensas

Materials Track

MAT8A: Conformal Coating Effect on ATC Reliability - On Demand

- By Martin Anselm

MAT3A: TB2013 Surface Finish Failure Analysis - On Demand

- By Babak Arfaei

MAT7A: New Alloy Project - On Demand

- By Babak Arfaei

MAT7A: New Lead Free Alloy Evaluation and Microstructure - On Demand

- By Francis Mutuku

MAT1A: Underfill Update - On Demand

- By Pericles Kondos

MAT6B: Fatigue Behavior of New Die Attach Alloys

- By Harry Schoeller

MAT6A: Update Effect of Sn on HMP Solder - On Demand

- By Harry Schoeller