2013 Meetings

September Meeting

Business Cards

Martin Anselm – Introduction

David McCann Vice President, Packaging and R&D, GLOBALFOUNDRIES – Keynote

Trends in the Development and Implementation of Interconnect and Packaging Technologies

MATERIALS TRACK

Harry Schoeller – MAT4A: TIM, The Effect of Thermal Storage on Gap-Pad Performance (On Demand)

Pericles Kondos – MAT1A: Underfill Studies - Process Development and Characterization (On Demand)

Yuan Zeng – MAT10A: Laminate and Glass Studies in Pad Cratering (On Demand)

Babak Arfaei – MAT7A: New Alloy Reliability Testing - Effect of Size and Composition (On Demand)

Francis Mutuku – MAT7A:

Effect of Solder Composition and Trace Elements on Mechanical Shear Fatigue (On Demand)

RELIABILITY TRACK

Sa’D Hamasha – REL2A:

Accounting for the Evolution of SnPb and SnAgCu Properties and the Resulting Breakdown of Linear Damage Accumulation Rules in Cycling with Varying Amplitudes (On Demand)

Prof. Peter Borgesen (Binghamton University) – REL2A:

Current LF Models and Progress Update on Modification (On Demand)

Pericles Kondos – REL4A: Creep Corrosion - Effects of Test Methods (On Demand)

Gaurang Joshi – REL1A: PCB Prestress & Pad Cratering a Modified Test Method (On Demand)

Prof. Quang Su (Binghamton University) – REL3A:

Vibration Reliability Testing and Analysis

Prof. James Pitarresi (Binghamton University) – REL3A:

REL3A: Modeling and Characterization of Shock and Vibration (On Demand)

Babak Arfaei – MAT2B:

Effect of Isothermal Preaging on Accelerated Thermal Cycling Tests (On Demand)

ADVANCED PROCESS DEVELOPMENT TRACK

Yuan Zeng – APD3A: LGA vs BGA Pad Cratering (On Demand)

Michael Meilunas – APD2A: 0.3mm Pitch Build Report and Drop Testing and ATC Results (On Demand)

Michael Meilunas – APD3A: TB2013 Reliability Update (On Demand)

Babak Arfaei – APD3A: TB2013 Reliability Failure Mode Evaluation (On Demand)

Martin Anselm – MAT8A: Conformal Coating Early Reliability Data and Characterization (On Demand)

Harry Schoeller – MAT6A:

High Melting Point (HMP) Electronics - Test Board Design and Planning (On Demand)

During our September meeting we had the opportunity to thank our Members that have been with our organization for more than 10 years with a Partnership Award. Below are the images of the event and our recipients with our founder George Westby.

Rockwell Colins, David Adams

Rockwell Automation

Ashok Wadhwa and Bob Veale

IBM

Isabel de Sousa, Prabjit Singh, Mitch Ferrill &Jim Wilcox

Alcatel-Lucent

Richard Coyle & Holly Rubin

Ericsson, Lars Bruno

Plexus, Ursula Marquez de Tino

Celestica, Jeff Kennedy

Motorola Solutions

Henry Grossfeld, Brent Gingrich, Thomas Zanatta, (GW) and Eduardo Freire

Lockheed Martin

Dan Blass

June Meeting Presentations

Business Cards of our members and guests in attendance.

Agenda

Introduction by Martin Anselm

Introduction - On Demand

Materials Track

MAT4A - Component Level TIM Comparison by Harry Schoeller

MAT4A - Componentent Level TIM Comparison - On Demand

MAT1A - Underfill Research Plans by Pericles Kondos

MAT1A - Underfill Research Plans - On Demand

MAT10A - Pad Cratering Glass Orientation Effect by Yuan Zeng

MAT10A - Pad Cratering Glass Orientation Effect - On Demand

MAT3A - TB2013 Pad Finish Evaluation by Pericles Kondos

MAT3A - TB2013 Pad Finish Evaluation - On Demand

MAT6B - New Pb-free Die Attach Alloys by Harry Schoeller

MAT6B Harry - New Pb-free Die Attach Alloys - On Demand

MAT2B & MAT7A - Low Ag LF Microstructure and Reliability by Babak Arfaei

MAT2B & MAT7A - Low Ag LF Microstructure and Reliability - On Demand

MAT7A - Effect of Microstructure on Shear Fatigue by Francis Mutuku

MAT7A - Effect of Microstructure on Shear Fatigue - On Demand

X-ray Tomography, Presented by NSI GUEST SPEAKER, Wes Wren

Advanced Process Development Track

ADP3A - TB2013 Build Report and Printing Optimization by Michael Meilunas

ADP3A - TB2013 Build Report and Printing Optimization - On Demand

ADP4A - Vapor Phase Rework of High IO Components by Harry Schoeller

ADP4A - Vapor Phase Rework of High IO Components - On Demand

MAT5A - 0.3mm Pitch Update by Jeff Schake of DEK

MAT5A - 0.3mm Pitch Update - On Demand

Challenges in Rework for Smart Phones and Tablets, Presented by OKi GUEST SPEAKER, Paul Wood

Reliability Track

MAT8A - Impact of Conformal Coating on Thermal Cycling Reliability of SMT Components by Martin Anselm

MAT8A - Impact of Conformal Coating on Thermal Cycling Reliability of SMT Components - On Demand

REL1A - Modeling of Spherical Bend Test Method by Prof. Jame Pitarresi of BU

REL1A - Effect of Prestressing on PCB Pad Cratering by Michael Meilunas

REL1A - Effect of Prestressing on PCB Pad Cratering - On Demand

REL4A - Creep Corrosion Update - TB2013 Surface Finish Testing by Pericles Kondos

REL4A - Creep Corrosion Update - TB2013 Surface Finish Testing - On Demand

REL2A - Variable Loading of Low Ag Alloys by Sa'D Hamasha

REL2A - Variable Loading of Low Ag Alloys - On Demand

REL2A - Thermal Cycling, The Mechanisms Behind Surprising Trends by Sam Sirazi

REL2A - Thermal Cycling, The Mechanisms Behind Surprising Trends - On Demand

REL3A - Vibration Test Update and FA by Prof. Quang Su of BU

REL3A - Modeling and Characterization for Shock and Vibration by Prof. Jame Pitarresi of BU

February Meeting Presentations

Agenda

Attendance

Introduction

On Demand

By: Martin Anselm, Manager AREA Consortium

Pad Cratering

On Demand

By: Michael Meilunas

Paste Measurement

On Demand

By: Chris Anglin

0.3mm Pitch Print Development

On Demand

By: Jeff Schake (DEK)

Cycling Effect on Laminate Strength

On Demand

By: Pericles Kondos

Effect of Sn on HMP

On Demand

By: Harry Schoeller

Pb-free Die Attach Update

On Demand

By: Harry Schoeller

Angled HBP Methodology

On Demand

By: Pericles Kondos

PCB Material Testing Update

On Demand

By: Yuan Zeng (BU Student Research Associate)

Resonance Tracking Vibration Testing

By: Prof. Quang Su (BU Mechanical Engineering)

Strain Analysis

On Demand

By: Michael Meilunas

Modeling and Characterization for Shock and Vibration

On Demand

By: Prof. James Pitarresi (BU Mechanical Engineering)

Lead-Free Failure Mechanisms in ATC Testing

On Demand

By: Babak Arfaei

This Presentation includes both sessions of Babak's presentation.

Slow and High Speed Shear Testing of New Alloys

On Demand

By: Shantanu Joshi (BU Student Research Associate)

Digital Image Correlation

By: Prof. SB Park (BU Mechanical Engineering)

Component Level TIM Comparison

On Demand

By: Harry Schoeller

Fine Pitch Reliability Final Update

By: Michael Meilunas

Effects of ATC Parameters

On Demand

By: Michael Meilunas

Lead Free Solder Joints in Thermal Cycling

On Demand

By: Peter Borgesen (BU SSIE Department)

Comparing Lead Free Solder Alloys in Terms of Reliability

On Demand

By: Peter Borgesen (BU SSIE Department)

Wave Soldering Hole Fill Planning

By: Denis Barbini

Creep Corrosion Update - ENEPIG

On Demand

By: Pericles Kondos