2011 Meetings

October 2011 Consortium Meeting Details

Meeting Agenda

Attendees

PCB Issues:

Creep Corrosion: Liang Yin

Creep Corrosion - SWF file

Pad Cratering: Design Overview: Brian Roggeman

Updates on ZetaCap Project: Brian Roggeman

Pad Cratering in Rework: Pericles Kondos

Pad Cratering in Rework - SWF file

Assembly:

TMV PoP Assembly: Brian Roggeman

Epoxy Flux: Pericles Kondos

Epoxy Flux - SWF file

Head in Pillow Inspection Project: Michael Meilunas

Detecting Head in Pillow Defects - SWF file

Reliability:

Thermal Cycling Projects Update: Michael Meilunas

Thermal Cycling Projects Update - SWF file

Reliability Model: Peter Borgesen

Varying Cycling Amplitude: Younis Jaradat

Varying Cycling Amplitude - SWF file

Lead-Free Characterization:

Measuring Creep using DIC: Hohyung Lee

Controlling Microstructure: Babak Arfaei

Controlling Microstructure - SWF file

Microstructure Evolution during Fatigue: Liang Yin

Microstructure Evolution during Fatigue - SWF file

Damage Evolution in Cycling: Awni Qasaimeh

Damage Evolution in Cycling - SWF file

Other:

SERDP Whisker Project: Stephan Meschter

Overview of S3IP at Binghamton University: Bahgat Sammakia

Energy Efficient Data Centers: Bahgat Sammakia

June 2011 Consortium Meeting Details

Pad Cratering: Effects of ZetaCap Brian Roggeman

Cratering in Shock Pradosh Guruprasad

Effects of Assembly Damage on Cratering David Rae

Effect of Latent Laminate Damage on Cratering Pericles Kondos

Controlling SnAgCu Structures: Part I Babak Arafei

Controlling SnAgCu Structures: Part II Babak Arafei

Update on Thermal Cycling Michael Meilunas

On the Track of a Damage Function for Cycling of SnAgCu Awni Qasaimeh

Effects of Varying the Cycle Amplitude Younis Jaradat

More on Amplitude Variation Luke Wentlent

Creep Corrosion Liang Yin

ENEPIG Pericles Kondos

Intermetallic Bond Issues on ENIG Martin Anselm

Thermal Interface Tapes David Rae

TIM Printing and Cook-Book David Rae