2010 Meetings

March Presentations

Pad Cratering: Our Current Understanding and Test Plans

Pad Cratering: Latent Laminate Damage

ATC Reliability Testing Update

Effects of Solder Joint Dimensions on Life in Thermal Cycling

Solder Microstructure Evolution and Consequences

Mechanical Fatigue Study of Lead Free Alloys: Correlations with Strain Energy Density

On the Microstructure of Pb-free TSOP, QFN, and LGA Solder Joints: Consequences for Thermal Cycling Performance and Acceleration Factors

Effects of Pb-Free Solder Joint Size on Microstructure, Mechanical Properties & Aging Kinetics

On the Evolution of the Properties and Microstructure of Backward Compatible Solder Joints during Cycling and Aging

Lead-Free Solder Reliability in Complex Loading Environments

Assessment of Life of Lead Free Solder joints Under Realistic Service Conditions: Practical Consequences and Recommendations

ENEPIG Updates

Printing Considerations for Fine Pitch, Including 01005s and WLCSPs

Thermal Optimization of Filled-Polymeric TIM Bondlines

Creep Corrosion

Conformal Coatings

June Presentations

Update: Effects of Print Paste Volume on Drop Test Performance for 0.4mm Pitch CSPs

Reliability of Thermal Interface Tapes

Compaction Driven Performance Enhancement of Filled-Polymeric Thermal Bondlines

Thermal Interface Assembly Cook-Book

Cratering: Correlations Between Pad and Assembly Level Strength

Effects of Variable Loading on Pad Cratering

Intermetallic Failures on Electrolytic Ni/Au

Overview: Lead Free Solder Microstructure And Reliability

Effects of Lead Free Solder Joint Size on Aging Kinetics

Precipitate Coarsening and Recrystallization in Thermal Cycling of Lead Free BGAs

Cycling Induced Recrystallization of Lead Free BGA Joints in Cycling: Effects of Ag Content, Pre- and Post-Annealing

Solderability and Properties of Low-Ag Solder Alloys

Different Microstructure Evolution in Thermal Cycling of Lead Free TSOPs, QFNs, etc.

Combined Effects of Vibration and Thermal Cycling of Lead Free Solder Joints

Lead Free Solder Fatigue in Cyclic Bending: Effects of Variable Loading

Reliability and Microstructure of Backward Compatible Solder Joints

Thermal Cycling Update: TSOP, QFN, LGA, Passives, are Different From BGAs!

Reliability of Reballed Components

Lead Free Solder Joints on ENEPIG Pads

October Presentations

Thermal Interface Bondline Characterization

Pad Cratering Update

Assembly with Low-Ag Solders

Solar Power Packaging

Thermal Cycling Update & New Test Vehicle Designs

Effects of Solder Volume on Thermal Cycling Life

Effects of Solder Joint Dimensions on Aging Kinetics

Recrystallization

Effects of varying Load Amplitudes on Solder Joint Life

Backward Compatible Assembly: What Really Happens?

Solder Microstructure Evolution: Practical Consequences

Creep Corrosion of PCB Assemblies

Flexible Electronics

0.4mm Pitch PCB Design

Drop Testing of 0.4mm CSPs: Correlation to Print Voume

Tin Whiskers