2009 Meetings

March, 2009 Presentations

Fatigue of low-Ag solder joints

Thermal cycling of lead free solders

Empirical modeling of thermal cycling test results

Crack initiation and growth in lead free solder joints during thermal cycling and cyclic bending, including the potential for much faster life prediction

Lead free solder microstructure

Quantitative understanding of recrystallization and consequences for lead free life assessment Materials

Results and models for the effects of varying loads on lead free fatigue (Miner's rule)

Tutorial on the mechanisms and complications of solder pad cratering

A serious risk of pad cratering is universally overlooked

Cratering and solder failure for different SAC alloys in drop and cyclic impact (pendulum) testing

Printing of solder paste for 0.4mm pitch area array assembly manufacturing

Intermetallic bonds to ENEPIG and Ni/Au pad finishes

Performance of underfills and edge bonds in drop testing

Voiding in Cu3Sn

Characterization of Thermal Interfaces

Precommercial TIM Process Development and Reliability Evaluation

Thermal Tape Characterization

June, 2009 Presentations

Reliability Investigation of SN100C: Phase II

Lead Free Thermal Cycling Progress

Failure Analysis

Pad Cratering Test Methods

Recrystallization of SAC Solder Joints in Thermal Cycling

Accelerated Aging of Lead-Free SolderJoints

Effects of Different Load Combinations on Pb-Free Solder JointsSn

Reflowing Low-Ag(+X) Joints

Lead Free Solder Joint Reliability

The Manhattan Project

Sporadic Failure of Solder Joints on Ni/Au Pads

Thermal Bondline Assembly

Rapid Ranking and Screening Procedures for Underfills and Corner/Edge Bonds

October, 2009 Presentations

Thermal Cycling Update

Neural Network Analysis of Thermal Cycling Data

Pad Cratering

Pad Crater Testing

New Thermal Interface Materials

Reliability of Thermal Interface Materials

Spalling in Lead Free Solder Joints

Microstructure of Low-Ag Alloys

Soldering with Low-Ag Alloys

Damage Accumulation Under Variable Loads

Damage Accumulation and Microstructure

Microstructure Evolution in SnAgCu Solder Joints

Edge and Corner Bonding

Testing for IMC Issues on Ni Pads

Flux Dipping

Reballing

ENEPIG

Consortium Reports