2004 Meetings

June, 2004 Presentations

BGA Underfilling

BGA Underfill Analysis

ENIG Pad Finish Studies

Effect of Component Weight on Double-Sided No-Pb Assembly

Analysis of Early Failures Among Fine Pitch CSP Assemblies

Effects of Reflow Ambient and Paste Printing on Reliability of No-Pb Fine Pitch Assemblies

Effect of PCB Immersion Silver Thickness on 2nd Level Reliability

Introduction to the Sekisui Micropearl SOL

Mechanical cycling and Failure Analysis of Mixed Solder CSP Assemblies (I)

Mechanical cycling and Failure Analysis of Mixed Solder CSP Assemblies (II)

MLF Assembly and Reliability

Solder Joint Reliability as a Function of Ag % (& Cu %)

Rework Cookbook Development

Effect of Temperature Ramp Rate on 2nd Level Reliability

Gold Bumped Flip Chip Assembly

Gold Bumped Flip Chip Assembly (Part II)

Flip Chip Reliability After Aging

No-flow Flip Chip Assembly on Flex - Substrate Issues

Flip Chip Reliability Test Results

Framing the Process Window: Optimizing Thermal Interface Assembly

Codification Software: Placement Yield Module

October, 2004 Presentations

BGA Underfilling

Pb-free Chip Cap Failure

Influence of Composition and Cooling Rate on the Microstructure of Sn-Ag-Cu Solder Alloys

Kirkendall Voiding in Cu Pads and Other Pad Issues

Effects of Reflow Parameters and "Memory" on Pb-Free Solder Joint Microstructure

Concerns with Mixing Sn/Pb and Pb-Free Solders

Summary: Fragility of SAC Joints

PCB Damage in Pb-Free Reflow and Rework

PCB Cu Plating Anomalies and Thermal Failure Mechanisms

Assembly with No-Clean Polymer Flux (NPF)

Profiling Issues in Lead-Free Rework

Update: Rework Cook-Book

Effect of Thermal Cycle Dwell Time on 2nd Level Reliability

Flip Chip Reliability after Aging

Au-bumped Flip Chip

Board Design Issues for Flip Chip

Gold Bump FC

Moisture/Reflow Testing

Soldering Evaluation of New Flip Chip Fluxes

RFID Project

Assembly with Thermal Interface Materials

CALCEPWA Reliability Prediction Software

March, 2005 Presentations

Alternate QFP Surface Finishes

Ball and Polymer Collar Attach to Fine Pitch CSP With Kester 9690 No-clean Polymer Flux

BGA Underfilling

Copper Structures and Pad Evaluation

Cu Consumption Study

Effects of Thermal Cycle Dwell Time on 2nd Level Reliability

Influence of Composition and Cooling Rate on the Microstructure of SnAgCu Solder Alloys

Lead Free Assembly -- Board Damage Assessment

Lead-Free Reflow: Board Damage and Thermal Analysis Correlations

Lead-free Rework Guide

Lead-free Rework Issues

Mixed Assembly Reliability

Mixed SnAgCu/SnPb Solder Joints

SAC Fragility - Intermetallic Growth

SAC Fragility - Introduction

SAC Fragility - Speculation

Sekisui Micropearl SOL (Resin Bump)

SIMS Analysis, 'Good' & 'Bad' Cu

Surface Mount Capacitor Reliability After Lead-free Assembly

The Behavior of Voids in Cu-Sn

Where Do Voids Form and Grow?

Flip Chip Reliability Experiments

Gold Bump Flip Chip

Reflow Encapsulant Reliability

Thin Flip Chip BGA Project

Improving Thermal Interface Bondlines