2002 Meetings

June, 2002 Presentations

Area Array Research Consortium

Lead-Free Soldering Programupdate On Flip Chip Activities In The Area Array 2002 Consortium

Flip Chip Reliability - A Brief Review

Underfill Comparisons In Air-To-Air Cycling And Liquid Shock

Accelerated Testing Of Flip Chip Underfill - Sensitivity To Aging/Moisture - An Update

Jet Dispensing Of No-Clean Liquid Fluxes For Flip Chip Assembly

Lead-Free Pbga Reliability

Area Array Research Consortium Lead-Free Soldering Program Summary

Lead Free Bga Aatc Reliability

Comparison Of Pb-Free Solder On Uic Test Boards And Components

October, 2002 Presentations

Flip Chip Program Update

Flip Chip Results High Temp Jedec Level 3 Testing, Molded Flip Chip & Flip Chip On Flex

Flip Chip Assembly In Air And Reliability

Jet Dispensing Of Liquid Fluxes For Flip Chip Assembly

Pb-Free Flip Chip Assembly

Pb-Free Flip Chip Reliability

Packaging Passives And Passing Telcordia

Area Array 2002 Consortium Presentation Immersion Silver Pcb Finish

Evaluation Of Underfilling Methods For Csp Assemblies

Flux Only Assembly Of Wafer Level Chip Scale Packages

Qfp Assembly & Lead Pull Study (Alternate Surface Finishes)

Lead Free Testing Update

Area Array Reliability Update

Minimization Of Damage To Optical Fibers During Cleaving, Stripping, And Splicing

On The Loss Of Mass From Optical Adhesives Before, During, And After Cure

Pin Transfer Of Adhesives

Codification Software

Alternate Surface Finishes - Assembly And Reliability Updates

Reliability Of Double-Sided Assemblies

March, 2003 Presentations

Pb-Free Flip Chip Assembly & Reliability

Pb-Free Metallurgy Design And Process Issues

Flip Chip Assembly In Air And Reliability

Flux Jetting Process Development And No-Clean Liquid Flux Evaluation

Transfer Molding Of Flip Chips

First-Level Assembly And Reliability Of An Overmolded Flip Chip Csp

Flip Chip On Flex

Reliability Comparison Of 15 Underfills

Reliability Testing: What Are We Missing?

High Temperature Jedec Level 3 Moisture/Reflow Sensitivity Testing

Overview Of 2577 I/O, 52.5 Mm Hyperbga Assembly, Rework, And Reliability Project

Flux Only Assembly Of Wafer Level Chip Scale Packages

Optical Fiber Test Interpretation

Area Array Reliability Overview 2002

Qfp Assembly & Lead Pull Study (Alternate Surface Finishes)

Optoelectronics Packaging 2002

Assembly & Test Of Csps On Flex Pcbs

Pin Transfer And Dispensing Of Very Small Adhesive Volumes

Codification Software - 2003

Updates In Codification Software - 2003

Alternate Surface Finishes – Solderability, Assembly & Reliability

Reliability Of Double-Sided Assemblies