Board Designs

The test boards below were designed by AREA Consortium staff (principally Mike Meilunas) for specific research projects. Design data for these boards are linked here for download and use by our members.

HTTB2015

The High Temperature Test Board 2015 was fabricated with polyimide based laminate materials to enable high temperature reflow processes. It was used for various elevated temperature evaluations such as for passive device terminations and intermetallic growth kinetics.

TB 2015

The 2015 Test Board was designed to provide test vehicles for alternate solder alloy, surface finish and conformal coating projects.

TB2013 Gerber Final

As part of many of our studies for 2013 a new Test Board has been designed to provide test vehicles for surface finishes, underfills, conformal coating, etc.

Fine Pitch Test Board 2012 REV A - Open Vias

JEDEC drop test board.

Fine Pitch Test Board 2012 REV B - Filled Vias

JEDEC drop test board.

Fine Pitch Test Board 2012 REV C - 16x16WLP

0.3mm pitch JEDEC drop test board.

Fine Pitch Test Board 2012 REV D - 8x8WLP

0.3mm pitch JEDEC drop test board.

4 Point Bend Board Gerber

4 Point Bend 2009 Rev2

Spherical Bend Test Vehicle 2011

10 layer test board for evaluating 370HR with Zeta cap and Nelco 4000-6 laminates.

Spherical Bend Test Vehicle - Pad Cratering Test Board 2012

Pre-stress test board for 2012

Drop Test Board 2013

Drop test design based upon proposed standard that supersedes the JESD22-B111.

TB2013B Phoenix

Sn/Pb Conformal coat board design for 2013

Vibration Test Vehicle 2013

Spherical Bend Board TV2011

Test board for evaluating PCB laminates IT150DA, IT200LK, & EM828.