2020 Meetings - UIC Advanced Process Laboratory

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2020 Meetings

March Meeting

Welcome/Introduction

by Jim Wilcox

MAT7F. Microstructure Observations in As-Reflowed SnBi Mixed Solder Joints

by Luke Wentlent

REL17A. Effects of Current Stress on the Microstructure of SnBiAg-SAC Mixed Solder Joints

by Faramarz Hadian, et al.

MAT7I. Low Temperature Solder Thermal Cycle Reliability Testing and Failure Mechanisms

by Michael Meilunas and Luke Wentlent

MAT7F. Mechanical Behavior of Low Melt Mixed Assembly Joints

by Luke Wentlent

REL8A. ATC Reliability of Large Body WLCSP and SMT Devices on Low CTE PCB

by Michael Meilunas

MAT3B. PCB Surface Finishes: EPAG, ENIG, & Cu/OSP

by Michael Meilunas

REL18A. Failure Detection in Underfilled Components

by Michael Meilunas

MAT1C. Component Underfill and Edge Bonding Project Update

by Pericles Kondos

MAT4C. Thermal Cycle Testing of Thermal Grease and Phase Change Materials

by Peter McClure

MAT4E. Liquid Ga-In Die Level Thermal Interface Material -- Initial Studies

by Peter McClure

APD3C. Copper Coin PCBs -- Preliminary Reliability Evaluation

by Peter McClure

REL2B. High Performance Solder Alloy Studies: Thermal Shock and Dwell Time Effects

by Luke Wentlent

Thermal Fatigue of High Performance Pb-Free Solder Alloys (iNEMI)

by Richard Coyle

APD11B. Selected Area Laser Reflow of Temperature Sensitive Components

by Luke Wentlent

REL9A. Mixed VIPPO BGA Array Solder Defects

by Pericles Kondos and Tian Sang

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