- By Martin Anselm

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MAT1A – Underfill Part I - On Demand

- By Pericles Kondos
MAT1A – Underfills and Adhesives-Part II - On Demand

- By Mohammad Quaran
MAT4A – Characterization of Gap Pads with Fixed Bondline and Phase Change Materials - On Demand

- By Harry Schoeller
REL11A – Effect of Compression Loads on BGA Reliability - On Demand

- By Nicholas Graziano
MAT8A – Conformal Coating Update - On Demand

- By Martin Anselm
MAT2A – Pad Cratering in TB2014-ELM - On Demand

- By Pericles Kondos
MAT6C – Characterization of High Temperature Solder Alloys - On Demand

- By Harry Schoeller
MAT7B – Effect of Microstructure on Isothermal Mechanical Properties of Various Solder Alloys - On Demand

- By Francis Mutuku
MAT7C – Effect of Isothermal Aging on Reliability of LF Product - On Demand

- By Babak Arfaei
The Effect of Microalloying on Thermal Fatigue Reliability and Microstructure of SAC Solders Ni Microalloying 

- By Janice Meraglia (VP for Military and Government Programs at Applied DNA Sciences)
MAT6B – Characterization of High Temperature Solders used for Passive Devices - On Demand

- By Harry Schoeller 
MAT5A – Paste Print Project Status Update

- By Chris Anglin

- By Peter Borgesen

REL6A – Print Correlations to Reliability- On Demand

- By Michael Meilunas
REL3A – LGA vs. BGA Vibration Performance

- By Aaron Stewart
REL10A – Drop test JESD22-B111 Redesign Evaluation Characterization of Proposed JEDEC Drop Test Vehicle

On Demand

- By Michael Meilunas
MAT7A – Effect of Nanodopants on Reliability of LF Solders in Drop Testing - On Demand

MAT4A: Component Level TIM Characterization (Final Report) - On Demand

- By Harry Schoeller
REL2A: Correlation Between Accumulated Work and Fatigue Life of Lead-free Solder Joints - On Demand

- By Sa'D Hamasha
REL2A: Effects of Sn-grain Orientation on the Fatigue Life of Lead-free Solder Joints - On Demand

- By Sa'd Hamash and Luke Wentlent

REL10A: Drop Test JESD22-B111 Redesign Evaluation 

- By Michael Meilunas
REL4A: Creep Corrosion - On Demand

- By Pericles Kondos
REL9A: HDI Design Review 

- By Michael Meilunas

REL3A: Circuit Board Strain Laser Vibrometer 

- By Prof. Quang Su (Binghamton University)
REL3B: Vibration Reliability Plans 

- By Prof. Quang Su (Binghamton University)

    - Prof. Su's Combined Presentations On Demand

Design and Reliability - On Demand
    1 Inch Metal Ball Drop on Glass - Video
    300mm Wafer Warpage during Reflow - Video
    Cell Phone Case with PCB - Video
    Board Strain - Video
    Component Warpage at Elevated Temperature - Video

- By Prof. SB Park
Modeling and Characterization for Shock and Vibration - On Demand

- By Prof. James Pitarresi (Binghamton University)

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APD3B: WLCSP Reliability Analysis Effect of RDL Design on Thermal Cycle Results 

- By Michael Meilunas
APD8A: BGA vs. LGA Drop Test Comparison - On Demand

- By Gaurang Joshi
ADP3A: TB2013 ATC Reliabiliy 

- By Michael Meilunas
SPI Optimization - Koh Young - On Demand

 - By JD Shin of Koh Young
BVA Review - Invensas - On Demand

- By Charles Woychik of Invensas

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MAT8A: Conformal Coating Effect on ATC Reliability - On Demand

- By Martin Anselm
MAT3A: TB2013 Surface Finish Failure Analysis - On Demand

- By Babak Arfaei
MAT7A: New Alloy Project - On Demand

- By Babak Arfaei
MAT7A: New Lead Free Alloy Evaluation and Microstructure - On Demand

- By Francis Mutuku
MAT1A: Underfill Update - On Demand

- By Pericles Kondos
MAT6B: Fatigue Behavior of New Die Attach Alloys 

- By Harry Schoeller
MAT6A: Update Effect of Sn on HMP Solder - On Demand

- By Harry Schoeller