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2009 Meetings

March, 2009 Presentations

Fatigue of low-Ag solder joints
Thermal cycling of lead free solders
Empirical modeling of thermal cycling test results
Crack initiation and growth in lead free solder joints during thermal cycling and cyclic bending, including the potential for much faster life prediction
Lead free solder microstructure
Quantitative understanding of recrystallization and consequences for lead free life assessment Materials
Results and models for the effects of varying loads on lead free fatigue (Miner's rule)
Tutorial on the mechanisms and complications of solder pad cratering
A serious risk of pad cratering is universally overlooked
Cratering and solder failure for different SAC alloys in drop and cyclic impact (pendulum) testing
Printing of solder paste for 0.4mm pitch area array assembly manufacturing
Intermetallic bonds to ENEPIG and Ni/Au pad finishes
Performance of underfills and edge bonds in drop testing
Voiding in Cu3Sn
Characterization of Thermal Interfaces
Precommercial TIM Process Development and Reliability Evaluation
Thermal Tape Characterization

June, 2009 Presentations