Meetings‎ > ‎

2008 Meetings

June, 2008 Presentations


Update on Voiding in Cu3
A Case Study of Sproadic Brittle Failure on Ni/Au Surface Finish
Brittle Failures on Ni/Au Finishes: Part II
Package-on-Package Assembly and Reliability Investigation
Vibration Test Results
Lead Free Thermal Cycling Progress<
"High Density" Reliability Test
Pb-Free Laminate Testing and Recommendations
Pad Cratering UpdateSn: An Update
CAF Response to Mechanical Loading
PCB Damage in Area Array Repair: Week 41 Update
Controlling the Rework Profile
Thermal Interface Bondline Assembly
Quantitative Acceleration of Long-Term Agin
Microstructure Evolution in Pb-Free Solder Alloys During Isothermal Aging
Microstructure Evolution in Pb-Free Solder Alloys During Thermal Cycling
Solar Panel Technology
Paste/Underfill Compatibility Update
Underfill Flow Studies
Mechanical Test of Edge and Corner Bond Assemblies
Underfill and Solder Joint Loading in Thermal Cyclin

March, 2009 Presentations

Drop Testing Update
Thermal Cycling Update
Thermal Cycling Induced Microstructure Evolution in Lead Free Solder
Cycling Induced Recrystallization of Lead Free Solder and Why You Should Care
Acceleration of Long Term Aging Effects in Lead Free Solder
The Complete Breakdown of Miner's Rule in Load Controlled Cycling of No-Pb Solder
On the Breakdown of Miner's Rule for Lead Free Solder
Vibration Testing of Multiple Alloys & Pad Finishes
Thermal Interface Materials
Electrolytic Cu Plating Recommendations
The Nature of Pad Cratering
PCB Cook Book Update & Halogen Free PCB Plans
Digital Human Modeling Technology: Overview, Opportunities, and Applications
Component Underfill Cook Book
Adhesion/Cohesion Testing of Underfills and Corner/Edge Bonding Materials
Drop Testing of Corner/Edge Bonded Assemblies
Lead Free Rework
Area Array Repair Cook Book