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Recent site activity
179
days until
October 13-14, 2021 AREA Meeting
Meetings
>
2007 Meetings
June, 2007 Presentations
QFN Process Development and Reliability Project
On the Behavior of Bubbles in Liquids
Voiding in Paste-Only Solder Deposits
Component Underfills
Package-on-Package
Voiding in Cu3Sn
Copper Electroplating and Voiding in Cu3Sn
Effects of Microstructure on Lead Free Solder Joint Reliability
Lead Free Solder Joint Fatigue Study
Pb-Free Thermal Cycle Testing Overview
Challenges in Thermal Cycling of Lead Free Solders
FCBGA Thermal Cycling Project
Lead Free HASL Project Update
2008 Plans?
Pad Cratering Update
Missing Ball and Other Brittle Failures on Ni/Au
Effects of Au on Brittle Failures in Assemblies on Electrolytic Ni/Au
Investigations of Brittle Failure of IMCs on ENIG
Underfill for Lead Free Flip Chips
Reballing Lead Free Components with SnPb
October, 2007 Presentations
Advanced Process Laboratory: Process Research and Support
Lead Free PCB Projects Update
Lead Free HASL
Pad Cratering: Correlations Between Joint Level and Board Level Testing
High Speed Bond Testing
CSP Underfill and Edge/Corner Bonding Studies
Intermetallic Formation in the Sn-Cu-Ni System
Brittle Failures of Joints on Electrolytic Ni/Au
Copper Electroplating and Voiding in Cu3Sn: An Update
Preconditioning of Lead Free Solder Joints
Solder Joint Strain Analysis
Thermal Cycling of Lead-Free Solder
Thermal Bondline Assembly
TIM Studies
Lead Free FC Thermal Cycling Parameters
Effects of Solder Microstructure on Fatigue
Reliability Test Plans & Schedule
Solder Paste Selection for QFN Assembly
Component Characterization
Redressing Repair
A Rework Process for LGA Components
March, 2008 Presentations
Advanced Process Laboratory/AREA Consortium
Pb Free Solder Alloy Reliability Update
Mixed Solder Alloy Reliability Update
Voiding in Cu3Sn: Why it is Sporadic?
Solder Joint Strain Analysis
Fine Pitch Flip Chip and TSV Based Die Stacking
Pad Cratering:Relating Pad-Level Testing to Board Level Reliability
Intermetallic Bonds to Ni/Au Pads
CSP Underfill and Edge/Corner Bonding Studies
Lead Free PCB Projects Update
Cycling Results for Pb-Free Flip Chips with 8 Underfills
Thermal Cycling Test Protocols for Lead-Free Solder
APLWeb Online Registration and Tools
Relationships between Drop Reliability and Energy
Ongoing and Future Repair Projects
Thermal Cycling Test Protocols for Lead-Free Solder
Correlations Between Microstructure and Fatigue Life in Pb Free Solder
Effect of Reflow Profile on Sn Undercooling and Microstructure Evolution in Sn-3.5Ag and Sn-3.9Ag-0.6Cu Lead Free Alloys
Thermal Interface Bondline Assembly
Void nucleation, Growth and Shrinkage in SAC405/Electrodeposited Cu Foil Solder Joints
2007 Master Report List (Excel file)
