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190
days until
October 14-15 AREA Meeting
Meetings
>
2003 Meetings
June, 2003 Presentations
Microstructure of Mixed Tin-Lead / No-Lead Solder Joints
"Mixed" CSP and BGA Reliability
0.4 mm Pitch CSP Printing
0.4 mm Pitch CSP Assembly & Reliability
Solder Joint Bridging in 0.4 mm Pitch CSP Assembly
Soldering to Electroless Ni/Immersion Au - The "Black Pad" Failure Mechanism
2nd Level Reliability Update
Underfilling by Stencil Printing
Room Temperature Underfilling
The Most Promising Underfills
Package Underfilling
High Temperature JEDEC Level 3 Moisture/Reflow Sensitivity Testing
Progress on Assembly of Au-Bumped Flip Chips to Solder Bumped Substrates
Effects of Electromigration in No-Pb Flip Chip Assemblies
Reliability Effects of Thermal Excursions and Thermal Aging on SAC-Bumped Flip Chips
No-Lead Flip Chip Joint Microstructure Effects of Thermal History and Process Variables
Pb-Free Reflow Encapsulants
Lid Attach
A New Generation of Thermal Interface Materials; An Analytical and Experimental Study
Application of Thermal Interface Materials by Stencil Printing
Printing & Dispensing of Thermal Interface Material - An Initial Comparison
Evolution of Voids in Thermal Interface Material During Cure
Characterization of Thermal Interface Materials
October, 2003 Presentations
Reliability of mixed SnPb/no-Pb solder joints
Microstructure evolution in mixed SnPb/no-Pb solder joints
Ag concentrations
Immersion Ag pad finishes -- variability and assembly
Reliability of area array assemblies on immersion Ag pad finishes
CSP underfilling by stencil printing
2nd Level reliability update
Squeegee based and pressure enhanced solder paste printing
0.4mm pitch CSP assembly
0.4mm pitch CSP rework and reliability
Materials for manufacturing in China - Preliminary PCB studies
Assembly of Au stud bumped flip chip
No-Pb flip chip assembly & reliability
Effects of cycling and aging on no-Pb flip chip solder joint microstructure
Effects of electromigration and aging on flip chip assemblies
Reliability of SnPb based flip chip assemblies with no-flow underfills
No-Pb flip chip assembly with, and reliability of,no-flow underfill
Flip chip technology transfer
High power component assembly onto heat sinks - Thermal interface materials and process issues
Heat sink attach to PBGA assemblies - Process and automation issues
March, 2004 Presentations
Metallurgy of Mixed No-Pb/SnPb Solder Joints
Mixed SnPb/no-Pb Soldering: Preliminary Recommendations
Effects of PCB Surface Finish on the Reliability of Area Array Packages
Fine-Pitch CSP Rework and Reliability
Pb-Free Area Array Reliability Update
Mixed Alloy Reliability (AATC) 2003
Sn-Ag-Cu Joint Inspection and Failure Analysis
Thermal Cycling Resistance of 0.4mm Pitch WLCSP Assemblies With Mixed Solder Joints
Lead Free Wave Soldering Process
Reliability Effects of Rework Induced Lead/No-Lead Solder Alloy Mixing
AATC Reliability and Lead Pull Testing
SnPb Based 0.4 mm Pitch WLCSP Assembly & Reliability
Area Array Sn/Pb Solder Joint Reliability Year End Wrap-Up
Mixed Hybrid Assemblie: NanoSphere Wafer Scale Package
Thermal Cycling Resistance of SnAgCu Based WLCSP Assemblies
Reflow Encapsulant Manual
Update on Pb-Free JEDEC Level 3 Moisture/Reflow Sensitivity Testing
Flip Chip Assembly Manual
Effects of High Temperature Aging on Thermal Cycling Resistance of LF2 Based Flip Chip Assemblies
Pb-Free Flip Chip Assembly
Gold Stud Bumped Flip Chip Assembly
The Most Promising Underfills
Flip Chip Underfilling By Stencil Printing
Underfill Manual
Sn-Ag-Cu Joint Inspection and Failure Analysis
Flip Chip Reliability and Test Protocols
No-Pb Flip Chip Assembly and Reliability with Reflow Encapsulants
Minimizing Thermal Resistance
Heat Sink Attach to PBGA Assemblies
Lid Attach
Deposition & Curing of Thermal Interface Materials
Process-Induced Filler Particle Separation in Thermal Interface Materials
Codification Software
